Musk's Terafab reportedly tells toolmakers it wants 1 million wafers a month by 2032, 700,000 of them memory
Nikkei reported the target, citing supplier talks; the memory share alone would roughly match Samsung's current DRAM capacity, and neither Tesla nor SpaceX has confirmed the figures.
Why it matters
If the reported plan holds, Terafab would go from no production to a memory output on the scale of the world's largest DRAM maker in about six years, at a time when AI demand has made memory the tightest part of the chip supply chain. TrendForce notes the total would be roughly 40 times the 25,000 wafers a month planned at Rapidus's Hokkaido plant. Mass production is reportedly planned for the second half of 2028. Watch for equipment orders from Japanese and Korean suppliers and for the partners, with Intel reportedly coordinating logic support.
Key facts
- Target: about 1 million wafers a month by 2032 (reported)
- About 700,000 for memory, more than 300,000 for logic
- Samsung's DRAM capacity: about 650,000–700,000 wafers a month
- Roughly 40 times Rapidus's planned 25,000 wafers a month
- Mass production planned for second half of 2028 (reported)
- Source: Nikkei, via TrendForce