EN ▾
SNAPE REP RT Front page →
UnconfirmedCompute03 Nov, 08:10 UTC

Baidu's AI chip unit Kunlunxin may push its $2bn Hong Kong IPO into 2027, Bloomberg reports

Image published by The Standard with its report on Kunlunxin's Hong Kong IPO timing
The Standard

The chip designer is still waiting for approval from China's securities regulator after filing confidentially in January; Baidu denied the market rumours. Kunlunxin had 4% of China's data centre AI chip market in the first half, against Huawei's 28%, per IDC.

Read at The Standard (Hong Kong) Share

Sources

More on Compute
More from Snape ReportFront page →