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UnconfirmedCompute03 Nov, 10:21 UTC

Samsung reportedly plans second Texas fab to make HBM base dies for AMD and Nvidia

Maeil Business, citing industry sources, reports Taylor Fab 2 will use 2-nanometre technology, break ground in November and start mass production in 2030 with its full output already ordered, mostly by AMD; Samsung declined to comment.

Read at UA.News, citing Maeil Business via CNA Share

Why it matters

The base die is the logic layer at the bottom of an HBM stack, and current HBM4 base dies use a 4-nanometre process. Making them in Texas would pair US-built logic with DRAM core dies from South Korea, according to the report. The plan would add a second Samsung fab at Taylor, where the first plant is tied to a supply deal with Tesla. The report is unconfirmed: watch for a Samsung announcement or the reported November groundbreaking.

Key facts

  • Taylor Fab 2 in Texas
  • 2-nanometre technology, per Maeil
  • About 2.7 million square feet
  • Equipment installation from February 2029
  • Mass production expected in 2030
  • Samsung declined to comment

Sources

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