Samsung's Lee Jae-yong inspects Yokohama advanced-packaging lab, calls packaging critical for AI chips

Samsung Executive Chairman Lee Jae-yong examines materials at the Advanced Package Lab in Yokohama — Samsung Electronics via The Korea Times

Samsung says the lab, which formally opened in September, will widen research to wafer bonding and glass substrates and expand its local staff, under a 40 billion yen ($254 million) five-year investment begun in 2024; no new customers or products were announced.

Read at The Korea Times

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